Tegal Corporation designs, manufactures, markets and services plasma etch and deposition systems (PVD) that enable the production of IC memory and related microelectronics devices used in personal computers, wireless voice and data telecommunications, radio frequency identification devices (RFID), smart cards, data storage and nano-scale actuators. |
New at Tegal!
Tegal is now the exclusive supplier of the AMS (Advanced Modular Sputtering) line of deposition tools for state-of-the-art aluminum nitride (AlN) based BAW / FBAR /SMR devices.
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All 6500 Series Plasma Etch systems feature either Tegal's patented dual-frequency HRe¯™ CCP process module technology. The production tested cluster platform design incorporated on all 6500 systems accommodates either one or two etch process modules for processing of 100mm to 200mm wafers. Each module can be configured to run independent processes—optimizing flexibility, minimizing downtime and maximizing wafer throughput. The 6500 system comes standard with one vacuum cassette elevator for wafer I/O. Optionally, a second vacuum cassette elevator or patented Rinse-Strip-Rinse™ corrosion passivation station may be added within the standard frame. Each system incorporates full cluster tool technology with the latest innovations in contamination control and factory automation. Tegal's 6500 Series systems have demonstrated their effectiveness in addressing the challenges of etching new materials in a production environment now and in the future.
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The Endeavor™ PVD cluster tool features Tegal's patented S-Gun™ magnetron sputtering source. The platform is designed to accept up to five process modules including a wide array of both dielectric and metal sputtering configurations in addition to plasma pre-clean modules. The transport system can accommodate 50mm to 200mm wafers , or 6" square reticles, in a unique "sputter-up" orientation that is extremely gentle and reliable. The unique handling system is especially advantageous for backside metallization on delicate ultra-thin silicon wafers , as it handles them without flipping or applying any mechanical pressure. Each system incorporates state-of-the-art cluster tool technology with the latest innovations in contamination control and factory automation. Flexible and robust, Tegal's Endeavor systems meet the challenges of depositing new materials in today's production environment with clear upgrade paths for the future.
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The Tegal AMS™ systems offer state-of-the-art PVD and reactive sputtering of aluminum nitride (AlN) films for piezoelectric devices such as BAW and FBAR filters. The acquisition of the AMS platform in 2007 represents Tegal's most recent product offering for MEMS device research and manufacturing. The Tegal AMS™ systems feature a unique implementation of the dual cathode S-Gun™ magnetron source specifically optimized for the most demanding film thickness uniformity specifications in the PVD industry (< 1.5% 3 sigma).
The AlN reactive sputtering module can be configured as a low-cost, stand-alone system for basic thin film research in the Tegal AMS SMT™ tool, or fully integrated for device production with one or two additional PVD modules for molybdenum (Mo) or other electrode materials in the Tegal AMS MMT™ cluster tool.
Aluminum Nitride Sputtering for BAW (FBAR & SMR) Devices |
The Tegal 900ACS™ Series combines a state-of-the-art Advanced Control System with the most durable and most reliable non-critical plasma etch tool in the semiconductor industry. No other line of single wafer cassette-to-cassette etch systems in production today offers the value and rapid return on investment for non-critical plasma etch processes for 3in to 150mm wafers. For customers already invested in the popular Tegal 900e Series, we offer affordable field upgrades to the Advanced Control System. ACS delivers faster throughput, faster system calibration, touchscreen graphical user interface, integrated data logging, and factory automation support. Don't be fooled by imitators. only Tegal offers this capability with the sound engineering and reliability to stand behind it and deliver the quality you've come to expect.
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The Tegal 980ACS™ Series extends the most durable and most reliable non-critical plasma etch tool in the semiconductor industry to serve the 200mm fab line. No other line of single wafer cassette-to-cassette etch systems in production today offers the value and rapid return on investment for non-critical plasma etch processes for 200mm wafers. ACS delivers faster throughput, faster system calibration, touchscreen graphical user interface, integrated data logging, and factory automation support.
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